Oscillator Chips and Hybrid Components
Bare die, Packages & Lids, Substrates, Quartz, Subassemblies
ASIC Oscillator IC
Die/unmounted chips: CMOS LVPECL LVDS HSCL
Ceramic LCC PackagesHermetic LCC ceramic package bases
Flat and Stepped Kovar Lids, plating options
Substrates and jumper blocks
AssembliesCeramic LCC base subassemblies
AT, IT, SC, Y cut swept and unswept quartz blanks
Quartz blanks, Wafers, Lumbered Bars
Component Bare die, Packages & Lids, Substrates, Quartz, Subassemblies for hybrid assembly of frequency control products for standard clock (XO), voltage controlled oscillators (VCXO), temperature compensated oscillators (TCXO), and oven controlled oscillators (OCXO).
Check design services for crystal blanks
Materials processing:
Crystal quartz blanks and plated crystal blanks
QCM crystals for monitoring thin film deposition
Wafers and bars of pure Z-Growth crystalline quartz, fused quartz, Schott glass, other hard materials
