5027

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The 5027 series are miniature crystal oscillator module ICs. The oscillator circuit stage has voltage regulator drive, significantly reducing current consumption and crystal current, compared with existing devices, and significantly reducing the oscillator characteristics supply voltage dependency.

Three (3) different pad layouts to fit various package options ranging from 7.0x5.0 mm to 2.5x2.0 mm, making these devices ideal for miniature crystal oscillators.

Block Diagram

Packages for 5027
Size (mm)	Package	Height w/o lid (mm)	Pads	D/A connection	Layout Type	Lid	Stepped Lid
2.5x2.0	S2520CLK1	0.82	4	NC	I	LDK2520-1.5-1N
2.5x2.0	S2520CLK5	0.82	4	VSS	FCWB	LDK2520-1.5-1N
3.2x2.5	S3225CLK5	0.94	4	VSS	I II FCWB	LDK3225-2-1N	LDSL3225-3-10N
5.0x3.2	S5032CLK6	1.2	4	VSS	II	LDK5032-3-1N	LDSL5032-3-N10
7.0x5.0	S5070CLK4	1.2	4	NC	I II FCWB	LDSL9014-2.5-11N	LDSL5070-5-10K LDSL5070-5-11K

*See full Package and Lid Reference Tables

Datasheets

Key Features

Wide supply voltage range: 1.60 to 3.63V
Regulated voltage oscillator circuit for reduced power consumption and low crystal drive current
3 pad layout options for mounting
- 5027Ax, Mx series : for Flip Chip Bonding
- 5027Bx, Nx series : for Wire Bonding (type I)
- 5027Cx, Px series : for Wire Bonding (type II)
Recommended oscillation frequency range
- Low frequency version : 20 MHz to 60 MHz
- High frequency version : 60 MHz to 100 MHz
- Low frequency version : 40 MHz to 110 MHz
Selectable by version: f₀, f₀/2, f₀/4, f₀/8, f₀/16, f₀/32, f₀/64
Standby CMOS input disables with high impedance output, oscillator stops
CMOS output duty level (1/2VDD) 50 ± 5% output duty 15pF output drive capability
Wafer form or Chip form for ceramic LCC assembly
-40°C to 85°C operating temperature range

Applications

Communications infrastructure
Computers
Industrial
System Clocks
Buffers

Benefits

Ubiquitous standard with Flexible layout options that cover all standard package layout for wirebond and Flipchip

5027

Packages for 5027