Hybrid Components

ASIC Oscillator IC
Die/unmounted chips

CMOS LVPECL LVDS HSCL
Assemblies
Ceramic LCC base subassemblies
Crystal Blanks
AT, IT, SC, Y cut swept and unswept quartz blanks
High Temperature Range IC
-55°C to 125°C Oscillator IC
Materials
Quartz Wafers Lumbered Bars
Ceramic LCC Packages
Hermetic LCC ceramic package bases
Lids
Flat and Stepped Kovar Lids, plating options
Substrates
Substrates and jumper blocks

Component bare die, packages, and subassemblies for hybrid assembly of frequency control products for standard clock (XO), voltage controlled oscillators (VCXO), temperature compensated oscillators (TCXO), and oven controlled oscillators (OCXO).
Check design services for crystal blanks

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