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Hybrid Components

Hybrid Components

ASIC Oscillator IC
Die/unmounted chips

CMOS LVPECL LVDS HSCL

High Temperature IC

Materials
Quartz Wafers Lumbered Bars

Packages Lids Substrates
Ceramic LCC; Metal Can; Kovar Lids

Component bare die, packages, and subassemblies for hybrid assembly of frequency control products for standard clock (XO), voltage controlled oscillators (VCXO), temperature compensated oscillators (TCXO), and oven controlled oscillators (OCXO).
Check design services for crystal blanks