Hybrid Components

ASIC Oscillator IC
Die/unmounted chips

CMOS LVPECL LVDS HSCL
Assemblies
Ceramic LCC base subassemblies
High Temperature IC
125°C and 105°C max rated IC's for small or dense packaging
Manufacturing and Test Hardware
Materials
Quartz Wafers Lumbered Bars
Packages Lids Substrates
Ceramic LCC; Metal Can; Kovar Lids

Component bare die, packages, and subassemblies for hybrid assembly of frequency control products for standard clock (XO), voltage controlled oscillators (VCXO), temperature compensated oscillators (TCXO), and oven controlled oscillators (OCXO).
Check design services for crystal blanks

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