VC America Ceramic Packages

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Ceramic Chip Carrier for SMT Applications

We supply ceramic chip carriers for SMT applications.  These state-of-the-art designs enable compact high performance and reliable operation designed in ever smaller package sizes

Design Support

We have fully integrated CAD systems for developing package designs and implementation into manufacturing.  Modeling can be performed to evaluate parasitic values, thermal dissipation analysis, mechanical stress, etc.  We have excellent soft tool, semi-hard and hard tool levels for production packages.  Electrolytic process solutions are available for many standard current products.  Electro-less process solutions are also available for newer high frequency applications.  Package sizes include the popular 5x7mm, 5x3.2mm, 3.2x2.5mm, 2.5x2.0mm, 3.8x3.8mm sizes, and smaller sizes to 1.6 x 1.0 mm are being proven now.  Special sizes are also available, including larger than 5x7.  Contact us for more details.

Package Lids for the VC America Packages

We have lids available for the 5.0 x 7.0 mm and the 5.0 X 3.2 mm packages listed below.

for VC America Packages

Open Tooled / Available Products Offering

Listed below are open tooled packages which can be readily purchased from us. If you need a modification or different design for your application, please call us, and we will try to find a solution or design which meets your needs. We can work with many different types of CAD files (dwg, dxf, etc.), so send us your drawings and product ideas. But, even napkins can work!  Contact us for more details. 

5.0 x 7.0 mmProduct TypeMfg Series Chips# of PadsPackage Height  mmDie Cavity  mm Die Backside contactCrystal Cavity mm Crystal Shelf spacing (mm)Seal Ring

S5070XTAL1

CrystalNA40.9NANA3.60 x 5.403.80 +/-0.05, no min lengthKovar Ring

S5070XTAL2

CrystalNA41.2NANA3.60 x 5.403.80 +/-0.05, no min lengthKovar Ring

S5070XTAL3

Crystal

NA40.9NANA3.60 x 5.403.80Kovar Ring

S5070CLK1

Clock Oscillator

NPC standard CMOS

CF5005 CF5006 CF5009 CF5020 etc.

41.572.2 x 1.85 x 0.3Vcc3.60 x 5.403.80  +/-0.1Kovar Ring

S5070CLK4

Clock Oscillator41.82.1 x 2.65Vcc3.60 x 5.403.5 length  x 3.2 widthKovar Ring

S5070CLK5

Clock Oscillator41.42.2 x 1.85 x 0.33Vcc3.50 x 5.403.80Kovar Ring

S5070CLK6

Clock Oscillator41.52.2 x 1.85 x 0.35Vcc3.60 x 5.403.80Kovar Ring

S5070CLK7

Clock Oscillator

NPC standard CMOS

CF5005 CF5006 CF5009 CF5020 etc.

DLD testing  (2 contacts on side end)

4 (6)1.52.2 x 1.85 x 0.35Vcc3.60 x 5.403.80Kovar Ring

S5070CLK2

Clock OscillatorNPC CF5035  1.6 to 3.6 Volt CMOS to 220MHz41.52.2 x 1.85 x 0.35Vss3.60 x 5.403.80Kovar Ring

S5070DCK1

Clock OscillatorNPC LVPECL and LVDS differential clock outputs  CF5034 CF5036 CF5037 OE=pin161.32.2 x 2.0Vss3.60 x 5.603.80Kovar Ring

S5070DCK2

Clock OscillatorNPC LVPECL and LVDS differential clock outputs  CF5034 CF5036 CF5037 with room for 0201 passive across crystal61.352.2 x 2.0Vss5.60 x 3.602.30Kovar Ring

S5070DCK3

Clock OscillatorNPC LVPECL and LVDS differential clock outputs  CF5034 CF5036 CF5037 OE=pin261.352.2 x 2.0Vss5.60 x 3.603.80Kovar Ring

S5070DCK4

Clock OscillatorMaxim differential output chip61.352.2 x 2.0Vss5.60 x 3.603.80Kovar Ring

S5070DCK5

Clock OscillatorNPC LVPECL and LVDS differential clock outputs  CF5034 CF5036 CF5037 OE=pin261.352.2 x 2.0Vss5.60 x 3.603.80Kovar Ring

S5070VCXO1

VCXONPC CMOS <1MHz to 50 MHz VCXO CF5073 series with pin1= OE61.352.2 x 2.0Vdd5.60 x 3.603.80Kovar Ring

S5070VCXO2

VCXONPC CMOS CF5073 series with bond option OE for pin 2 or pin 561.352.2 x 2.0Vdd5.60 x 3.603.80Kovar Ring

S5070VCXO3

VCXONPC LVPECL 80-200MHz CF5072 hybrid assembly61.65 Vss5.60 x 3.603.80Kovar Ring

S5070VCXO4

VCXONPC CMOS CF5073 series with bond option OE for pin 2 or pin 561.352.2 x 2.0Vdd5.60 x 3.603.80Kovar Ring
5.0 X 3.2 mmProduct TypeMfg Series Chips# of PadsPackage Height  mmDie Cavity  mm Die Backside contactCrystal Cavity mm Crystal Shelf spacing (mm)Seal Ring

S5032CLK1

Clock OscillatorNPC std. CMOS CF5005 CF5006 CF5009 CF5020 etc.41.101.50 x 1.90Vcc2.30 x 4.102.81Kovar Ring

S5032CLK2

Clock OscillatorNPC CF5035 package, enlarged cavity41.101.70x 2.0 +/- 0.05Vss2.30 x 4.102.81 nom.Kovar Ring

S5032CLK4

Clock Oscillator A&CMOS type layout41.101.5 x 1.9 2.30 x 4.102.81Kovar Ring
S5032XTAL1

Crystal

NA

4.58NANA2.30 x 4.102.80Kovar Ring
S5032XTAL2

Crystal

NA

4.56NANA2.30 x 4.102.80Kovar Ring
S5032XTAL3

Crystal

NA

4.65NANA2.30 x 4.102.40Kovar Ring
S5032XTAL5

Crystal

NA

4.56NANA2.30 x 4.102.80Kovar Ring
3.5 X 6.0 mmProduct TypeMfg Series Chips# of PadsPackage Height  mmDie Cavity  mm Die Backside contactCrystal Cavity mm Crystal Shelf spacing (mm)Seal Ring

S3560XTAL1

Crystal

NA

40.90NANA2.30 x 4.103.10 +/-0.1Kovar Ring
2.5 X 4.0 mm

S2540XTAL1

Crystal

NA4.60NANA1.70 x 3.202.8 pad to padKovar Ring
2.5 X 3.2 mm

S2532XTAL1

Crystal

NA

4.55NANA1.75 x 2.452.15 pad to padKovar Ring

S2532XTAL2

Crystal

NA

4.55NANA1.75 x 2.451.95 pad to padKovar Ring

Package Lids for the VC America Packages

VC America supplies lids for their Packages:

LDK5032-3-1N - Flat lid for the 5.0 X 3.2 mm package.  Datasheet is available.

LDK5070-4-10N - Flat lid for the 5.0 x 7.0 mm package.  Datasheet is available.

LDS5070-072 - Step lid (etched) for the 5.0 x 7.0 mm package.  The Outgoing AQL for this part is 2.5%.  The lids are bulk packaged.  Datasheet is available.

LDS5070-072A - Step lid (etched) for the 5.0 x 7.0 mm package.  The Outgoing AQL for this part is 0.65%.  The lids are 100% inspected and shipped in trays.  Datasheet is available.


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