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Ceramic Chip Carrier for SMT Applications Sumitomo is the world’s largest ceramic producer and third largest electronics packaging company. We supply ceramic chip carriers for SMT applications. These state-of-the-art designs enable compact high performance and reliable operation designed in ever smaller package sizes Design Support We have fully integrated CAD systems for developing package designs and implementation into manufacturing. Modeling can be performed to evaluate parasitic values, thermal dissipation analysis, mechanical stress, etc. We have excellent soft tool, semi-hard and hard tool levels for production packages. Electrolytic process solutions are available for many standard current products. Electro-less process solutions are also available for newer high frequency applications. Package sizes include the popular 5x7mm, 5x3.2mm, 3.2x2.5mm, 2.5x2.0mm, 3.8x3.8mm sizes, and smaller sizes to 1.6 x 1.0 mm are being proven now. Special sizes are also available, including larger than 5x7, however, SMIED does not support the 9x14mm package types. Contact us for more details.
Sumitomo Reference Materials
Package Lids for the Sumitomo Packages VC America supplies lids for the Sumitomo Packages: LDK5032-3-1N - Flat lid for the 5.0 X 3.2 mm package. Datasheet is available. LDK5070-4-10N - Flat lid for the 5.0 x 7.0 mm package. Datasheet is available. LDS5070-072 - Step lid (etched) for the 5.0 x 7.0 mm package. The Outgoing AQL for this part is 2.5%. The lids are bulk packaged. Datasheet is available. LDS5070-072A - Step lid (etched) for the 5.0 x 7.0 mm package. The Outgoing AQL for this part is 0.65%. The lids are 100% inspected and shipped in trays. Datasheet is available. |
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